 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| (R) STPS40170C HIGH VOLTAGE POWER SCHOTTKY RECTIFIER Table 1: Main Product Characteristics IF(AV) VRRM Tj VF(max) FEATURES AND BENEFITS 2 x 20 A 170 V 175 C 0.75 V K A1 K A2 K High junction temperature capability Low leakage current Good trade off between leakage current and forward voltage drop Low thermal resistance High frequency operation Avalanche specification A2 K A1 A2 A1 TO-220AB STPS40170CT D2PAK STPS40170CG DESCRIPTION Dual center tab Schottky rectifier suited for High Frequency Switched Mode Power Supplies. Packaged in TO-220AB, D2PAK and TO-247, these devices are intended for use to enhance the reliability of the application. A2 K A1 TO-247 STPS40170CW Table 2: Order Codes Part Numbers STPS40170CT STPS40170CG STPS40170CG-TR STPS40170CW Marking STPS40170CT STPS40170CG STPS40170CG STPS40170CW September 2005 REV. 1 1/8 STPS40170C Table 3: Absolute Ratings (limiting values, per diode) Symbol VRRM IF(RMS) IF(AV) IFSM PARM Tstg Tj dV/dt dPtot * : --------------dTj Parameter Repetitive peak reverse voltage RMS forward current Average forward current Tc = 150 C = 0.5 Per diode Per device Value 170 60 20 40 250 14100 -65 to + 175 175 10000 Unit V A A A W C C V/s Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage tp = 10 ms sinusoidal tp = 1 s Tj = 25 C 1 < ------------------------- thermal runaway condition for a diode on its own heatsink Rth ( j - a ) Table 4: Thermal Parameters Symbol Rth(j-c) Rth(c) When the diodes 1 and 2 are used simultaneously: Tj(diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Parameter Junction to case Per diode Total Coupling Value 1.2 0.85 0.5 Unit C/W Table 5: Static Electrical Characteristics (per diode) Symbol IR * Parameter Reverse leakage current Tests conditions Tj = 25 C Tj = 125 C Tj = 25 C VF ** Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C Pulse test: * tp = 5 ms, < 2% ** tp = 380 s, < 2% Min. Typ 7 0.69 0.79 Max. 30 30 0.92 0.75 1.00 0.86 Unit A mA VR = VRRM IF = 20A IF = 40A V To evaluate the conduction losses use the following equation: P = 0.64 x IF(AV) + 0.055 IF (RMS) 2 2/8 STPS40170C Figure 1: Average forward power dissipation versus average forward current (per diode) PF(AV)(W) 22 20 18 16 14 12 10 8 6 4 2 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 IF(AV)(A) T d=0.05 d=0.1 d=0.2 d=0.5 d=1 Figure 2: Average forward current versus ambient temperature ( = 0.5, per diode) IF(AV)(A) 22 Rth(j-a)=Rth(j-c) 20 18 16 14 12 10 8 6 4 T Rth(j-a)=15C/W d=tp/T tp 2 0 0 d=tp/T 25 tp Tamb (C) 50 75 100 125 150 175 Figure 3: Normalized avalanche derating versus pulse duration PARM (t p ) PARM (1s) 1 power Figure 4: Normalized avalanche derating versus junction temperature PARM (t p ) PARM (25C) power 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 t p (s) 10 100 1000 Tj (C) 0 25 50 75 100 125 150 Figure 5: Non repetitive surge peak forward current versus overload duration (maximum values, per diode) IM(A) 250 Figure 6: Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.9 200 0.8 0.7 d=0.5 150 TC=50C 0.6 0.5 0.4 0.3 d=0.2 d=0.1 TC=75C 100 TC=125C T 50 0.2 IM t 0 1.E-03 d =0.5 t(s) 1.E-02 1.E-01 1.E+00 0.1 Single pulse tP(s) 1.E-02 1.E-01 d=tp/T tp 0.0 1.E-03 1.E+00 3/8 STPS40170C Figure 7: Reverse leakage current versus reverse voltage applied (typical values, per diode) IR(A) 1.E+05 Tj=150C Figure 8: Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C 1.E+04 Tj=125C 1.E+03 Tj=100C 1.E+02 Tj=75C 100 1.E+01 Tj=50C 1.E+00 Tj=25C VR(V) 1.E-01 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 VR(V) 10 1 10 100 1000 Figure 9: Forward voltage drop versus forward current (per diode, low level) IFM(A) 20 18 16 14 Tj=125C (Maximum values) Figure 10: Forward voltage drop versus forward current (per diode, high level) IFM(A) 1000 Tj=125C (Maximum values) 100 12 10 8 6 4 2 0 0.0 0.1 0.2 0.3 VFM(V) Tj=125C (Typical values) Tj=125C (Typical values) Tj=25C (Maximum values) 10 Tj=25C (Maximum values) VFM(V) 1 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Figure 11: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35m) (D2PAK) Rth(j-a) (C/W) 80 DPAK 70 60 50 40 30 20 10 SCU(cm) 0 0 5 10 15 20 25 30 35 40 4/8 STPS40170C Figure 12: D2PAK Package Mechanical Data DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 0.098 0.106 0.03 0.23 0.001 0.009 0.70 0.93 0.027 0.037 1.14 1.70 0.045 0.067 0.45 0.60 0.017 0.024 1.23 1.36 0.048 0.054 8.95 9.35 0.352 0.368 10.00 10.40 0.393 0.409 4.88 5.28 0.192 0.208 15.00 15.85 0.590 0.624 1.27 1.40 0.050 0.055 1.40 1.75 0.055 0.069 2.40 3.20 0.094 0.126 0.40 typ. 0.016 typ. 0 8 0 8 REF. A E L2 C2 D L L3 A1 B2 B G A2 R C M * V2 * FLAT ZONE NO LESS THAN 2mm A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 Figure 13: Foot Print Dimensions (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 5/8 STPS40170C Figure 14: TO-247 Package Mechanical Data DIMENSIONS REF. V Millimeters Min. Typ. Max. Min. 4.85 2.20 0.40 1.00 3.00 2.00 2.00 3.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5 60 3.55 3.65 0.139 3.00 0.078 14.80 0.559 15.75 0.608 20.15 0.781 4.30 0.145 2.40 0.078 3.40 0.118 5.15 0.191 2.60 0.086 0.80 0.015 1.40 0.039 Inches Typ. Max. 0.203 0.102 0.031 0.055 0.118 0.078 0.094 0.133 0.429 0.620 0.793 0.169 0.728 0.582 1.362 0.216 0.118 5 60 0.143 A D Dia V E F A H F1 F2 F3 L5 L L2 L4 F1 V2 F(x3) M G E F2 F3 F4 L3 D L1 F4 G H L L1 L2 L3 L4 L5 M V V2 Dia. 6/8 STPS40170C Figure 15: TO-220AB Package Mechanical Data REF. H2 Dia L5 L7 L6 L2 F2 F1 L9 L4 F G1 G M E D C A A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 2.40 2.70 0.094 0.106 10 10.40 0.393 0.409 16.4 typ. 0.645 typ. 13 14 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 6: Ordering Information Ordering type STPS40170CT STPS40170CG STPS40170CG-TR STPS40170CW Marking STPS40170CT STPS40170CG STPS40170CG STPS40170CW Package TO-220AB D2PAK TO-247 Weight 2.20 g 1.48 g 4.4 g Base qty 50 50 1000 30 Delivery mode Tube Tube Tape & reel Tube Epoxy meets UL94, V0 Cooling method: by conduction (C) TO-220 - Recommended torque value: 0.55 Nm, Maximum torque value: 0.7 Nm. TO-247 - Recommended torque value: 0.8 Nm, Maximum torque value: 1.0 Nm. Table 7: Revision History Date 16-Sep-2005 Revision 1 First issue. 7/8 Description of Changes STPS40170C Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
Price & Availability of STPS40170C
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |